| Ronga | zvinhu | Normal kugona | Special kugona |
| layer count | Rigid-flex PCB | 2-14 | 2-24 |
| Flex PCB | 1-10 | 1-12 | |
| board | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm | |
| Min.Ukobvu | |||
| Max.Ukobvu | 6mm | 8mm | |
| Max.Size | 485mm * 1000mm | 485mm * 1500mm | |
| Gomba & Slot | Min.Hole | 0.15mm | 0.05mm |
| Min.Slot Hole | 0.6mm | 0.5mm | |
| Aspect ratio | 10:01 | 12:01 | |
| Trace | Min.Width / Space | 0.05 / 0.05mm | 0.025 / 0.025mm |
| Kushivirira | Tsvaga W / S | ± 0.03mm | ± 0.02mm |
| (W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
| Gomba kune gomba | ± 0.075mm | ± 0.05mm | |
| Hole Dimension | ± 0.075mm | ± 0.05mm | |
| Impedance | 0 ≤ Kukosha ≤ 50Ω : ± 5Ω 50Ω ≤ Kukosha : ± 10%Ω | ||
| Material | Basefilm Specification | PI : 3mil 2mil 1mil 0.8mil 0.5mil | |
| ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| Basefilm Mutengesi mukuru | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Coverlay Specification | PI: 2mil 1mil 0.5mil | ||
| LPI Ruvara | Green / Yero / Ichena / Nhema / Bhuruu / Tsvuku | ||
| PI Stiffener | T : 25um ～250um | ||
| FR4 Stiffener | T : 100um ~ 2000um | ||
| SUS Stiffener | T : 100um kusvika 400um | ||
| AL Stiffener | T : 100um ~ 1600um | ||
| Tepi | 3M / Tesa / Nitto | ||
| EMI kudzivirira | Sirivha firimu / Mhangura / Silver inki | ||
| Surface finish | OSP | 0.1 - 0.3um | |
| HASL | Sn : 5um - 40um | ||
| HASL (Leed yemahara) | Sn : 5um - 40um | ||
| ENEPIG | Ni : 1.0 - 6.0um | ||
| Ba : 0.015-0.10um | |||
| Au : 0.015 - 0.10um | |||
| Kuputira goridhe rakaomarara | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 1um | |||
| Flash gold | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 0.1um | |||
| ENIG | Ni : 1.0 - 6.0um | ||
| Au : 0.015um - 0.10um | |||
| Immesion sirivheri | Ag : 0.1 - 0.3um | ||
| Plating Tin | Sn : 5um - 35um | ||
| SMT | Type | 0.3mm pitch Connectors | |
| 0.4mm pitch BGA / QFP / QFN | |||
| 0201 Chikamu |