Kugadzirwa kwePCB yepamusoro-level redunhu mabhodhi hakungodi mari yepamusoro mune tekinoroji nemidziyo, asi inodawo kuunganidzwa kweruzivo rwevanyanzvi nevashandi vekugadzira. Izvo zvakanyanya kuoma kugadzirisa kupfuura echinyakare akawanda-layer edunhu mabhodhi, uye ayo mhando uye kuvimbika zvinodiwa zvakakwirira.
1. Kusarudzwa kwezvinhu
Nekuvandudzwa kwepamusoro-kuita uye akawanda-anoshanda emagetsi emagetsi, pamwe neakakwira-frequency uye yakakwirira-yekumhanya chiratidzo chekufambisa, zvemagetsi zvedunhu zvinhu zvinodiwa kuti ive yakaderera dielectric nguva dzose uye dielectric kurasikirwa, pamwe neCTE yakaderera uye kunyura kwemvura. . mwero uye zvirinani zvepamusoro-kuita CCL zvinhu kusangana nekugadzirisa uye kuvimbika zvinodiwa zvemabhodhi akakwira.
2. Laminated structure design
Zvinhu zvikuru zvinotariswa mukugadzirwa kwechimiro chelaminated kupikisa kupisa, kushingirira voltage, huwandu hwekuzadza glue uye ukobvu hweiyo dielectric layer, nezvimwe zvinotevera zvinofanirwa kuteverwa:
(1) Iyo prepreg uye yepakati bhodhi vagadziri vanofanirwa kuenderana.
(2) Kana mutengi achida yakakwira TG pepa, bhodhi repakati uye prepreg inofanira kushandisa inoenderana yakakwira TG zvinhu.
(3) Iyo yemukati layer substrate ndeye 3OZ kana pamusoro, uye prepreg ine yakakwira resin yemukati inosarudzwa.
(4) Kana mutengi asina zvakakosha zvinodiwa, kushivirira kwehupamhi hwe interlayer dielectric layer inowanzodzorwa ne +/- 10%. Kune iyo impedance plate, iyo dielectric ukobvu kushivirira inodzorwa neiyo IPC-4101 C/M kirasi kushivirira.
3. Interlayer alignment control
Iko kurongeka kwehukuru hwemuripo wemukati wepakati core board uye kutonga kwehukuru hwekugadzira hunofanirwa kubhadharwa zvakaringana nehukuru hwegraphic hwega hwega bhodhi repamusoro-soro kuburikidza nedata rakaunganidzwa panguva yekugadzira uye nhoroondo yedata ruzivo kune imwe. nguva yenguva yekuvimbisa kuwedzera uye kuderera kweiyo core board yeimwe neimwe layer. kuwirirana.
4. Inner layer redunhu tekinoroji
Nekugadzirwa kweakakwira-kukwira mabhodhi, laser yakananga imaging muchina (LDI) inogona kuunzwa kuti ivandudze kugona kwemifananidzo yekuongorora. Kuti uvandudze mutsara etching kugona, zvinodikanwa kupa muripo wakakodzera kuhupamhi hwemutsara uye padhi mune dhizaini yeinjiniya, uye nekusimbisa kana dhizaini muripo weiyo yemukati layer mutsara upamhi, mutsara wemutsara, saizi yekuzviparadzanisa nevamwe, yakazvimirira mutsetse, uye gomba-ku-mutsara kureba zvine musoro, zvikasadaro chinja engineering dhizaini.
5. Kudzvanya maitiro
Parizvino, iyo interlayer Positioning nzira pamberi lamination kunyanya dzinosanganisira: mana-slot positioning (Pin LAM), inopisa melt, rivet, inopisa melt uye rivet musanganiswa. Zvigadzirwa zvakasiyana-siyana zvinotora nzira dzakasiyana dzekumisa.
6. Kuchera maitiro
Nekuda kwepamusoro peyega yega, ndiro nemhangura yakakora, iyo inozonyatsopfeka dhiri uye nekupwanya blade. Huwandu hwemakomba, kudonha kumhanya uye kumhanya kutenderera kunofanirwa kugadziridzwa zvakakodzera.
Nguva yekutumira: Sep-26-2022