Anokwikwidza PCB Mugadziri

Ziviso pakubata "Chikamu Chekutadza Kuongorora Tekinoroji uye Dzidzira Nyaya" Kuongororwa kwechikumbiro Seminari huru

Yechishanu Institute of Electronics, Bazi reIndasitiri uye Ruzivo rweTekinoroji

Mabhizinesi uye masangano:

Kuti ubatsire mainjiniya uye matekinoroji kugona kuoma kwehunyanzvi uye mhinduro dzechikamu chekutadza kuongorora uye PCB & PCBA yekutadza kuongororwa munguva pfupi;Batsira vashandi vakakodzera mubhizinesi kuti vanzwisise zvine hungwaru uye vagadzirise iyo yakakodzera tekinoroji nhanho kuti vave nechokwadi chechokwadi uye kuvimbika kwemhedzisiro yebvunzo.The Fifth Institute of Electronics yeBazi reIndasitiri uye Ruzivo rweTekinoroji (MIIT) yakaitwa panguva imwe chete online uye pasina mhepo munaNovember 2020 zvichiteerana:

1. Kupindirana kwepamhepo uye pasina Indaneti kwe "Component Failure Analysis Technology uye Practical Cases" Ongororo yekushandiswa Kwemusangano mukuru.

2. Akabata zvemagetsi zvikamu PCB&PCBA kuvimbika kutadza ongororo tekinoroji kudzidzira nyaya yekuongorora online uye offline kuwiriranisa.

3. Online uye offline kuwiriranisa kwezvakatipoteredza kuvimbika kuedza uye kuvimbika indekisi verification uye zvakadzama kuongorora kwemagetsi chigadzirwa kukundikana.

4. Tinogona kugadzira makosi uye kuronga kudzidziswa kwemukati kwemabhizinesi.

Zvinyorwa zvekudzidzisa:

1. Nhanganyaya yekutadza kuongorora;

2. Kukundikana kuongorora teknolojia yezvigadzirwa zvemagetsi;

2.1 Maitiro ekutanga ekutadza kuongorora

2.2 Nzira yekutanga yekuongorora kusina kuparadza

2.3 Nzira yekutanga yekuongorora-inoparadza

2.4 Nzira yekutanga yekuongorora kunoparadza

2.5 Nzira yose yekukundikana kuongorora nyaya yekuongorora

2.6 Kutadza tekinoroji yefizikisi ichashandiswa muzvigadzirwa kubva kuFA kuenda kuPPA neCA

3. Common kukundikana kuongorora midziyo uye mabasa;

4. Main kukundikana modes uye inherent kukundikana nzira yemagetsi zvikamu;

5. Kutadza kuongororwa kwezvinhu zvakakura zvemagetsi, zviitiko zvekare zvehurema hwezvinhu (chip defects, crystal defects, chip passivation layer defects, bonding defects, process defects, chip bonding defects, imported RF devices - thermal structure defects, special defects, inherent structure, kukanganisa kwemukati, kukanganisa kwezvinhu; Kuramba, kukwanisa, inductance, diode, triode, MOS, IC, SCR, circuit module, nezvimwewo)

6. Kushandiswa kwekukundikana kwefizikisi tekinoroji mukugadzirwa kwechigadzirwa

6.1 Mhosva dzekutadza kunokonzerwa nedhizaini isina kunaka

6.2 Mhosva dzekutadza dzakakonzerwa nedziviriro yekutapurirana isina kunaka kwenguva refu

6.3 Mhosva dzekutadza kunokonzerwa nekushandiswa zvisina kunaka kwezvikamu

6.4 Mhosva dzekutadza kunokonzerwa nekusakwana kwekukanganisa kwemusangano chimiro uye zvinhu

6.5 Kutadza nyaya dzekuchinjika kwezvakatipoteredza uye mishoni dhizaini dhizaini

6.6 Mhosva dzekutadza kukonzereswa nekusaenderana

6.7 Mhosva dzekutadza kunokonzerwa nekusaita kushivirira dhizaini

6.8 Inherent mechanism uye kushaya simba kwekudzivirira

6.9 Kutadza kunokonzerwa nechikamu parameter kugovera

6.10 FAILURE kesi zvinokonzerwa nePCB dhizaini

6.11 Mhosva dzekutadza dzakakonzerwa nekukanganisa kwedhizaini dzinogona kugadzirwa