Anokwikwidza PCB Mugadziri

Ziviso pakubata "Chikamu Chekutadza Kuongorora Tekinoroji uye Dzidzira Nyaya" Kuongorora kwechikumbiro Seminari huru

Yechishanu Institute of Electronics, Ministry of Indasitiri uye Information Technology

Mabhizinesi uye masangano:

Kuti ubatsire mainjiniya uye matekinoroji kugona kuoma kwehunyanzvi uye mhinduro dzechikamu chekutadza kuongorora uye PCB & PCBA yekutadza kuongororwa munguva pfupi; Batsira vashandi vakakodzera mubhizinesi kuti vanzwisise zvine hungwaru uye vagadzirise iyo yakakodzera tekinoroji nhanho kuti vave nechokwadi chechokwadi uye kuvimbika kwemhedzisiro yebvunzo. The Fifth Institute of Electronics yeBazi reIndasitiri uye Ruzivo rweTekinoroji (MIIT) yakaitwa panguva imwe chete online uye pasina Indaneti munaNovember 2020 zvakateerana:

1. Kupindirana kwepamhepo uye pasina Indaneti kwe "Component Failure Analysis Technology uye Practical Cases" Ongororo yekushandiswa Kwepamusoro musangano.

2. Akabata zvemagetsi zvikamu PCB&PCBA kuvimbika kutadza ongororo tekinoroji kudzidzira nyaya yekuongorora kwepamhepo uye pasina Indaneti.

3. Online uye offline kuwiriranisa kwezvakatipoteredza kuvimbika kuedza uye kuvimbika indekisi verification uye zvakadzama kuongorora kwemagetsi chigadzirwa kukundikana.

4. Tinogona kugadzira makosi uye kuronga kudzidziswa kwemukati kwemabhizinesi.

Zvinyorwa zvekudzidzisa:

1. Nhanganyaya yekukundikana kuongorora;

2. Kukundikana kuongorora teknolojia yezvigadzirwa zvemagetsi;

2.1 Maitiro ekutanga ekutadza kuongorora

2.2 Nzira yekutanga yekuongorora kusina kuparadza

2.3 Nzira yekutanga yekuongorora-inoparadza

2.4 Nzira yekutanga yekuongorora kunoparadza

2.5 Nzira yose yekukundikana kuongorora nyaya yekuongorora

2.6 Kutadza tekinoroji yefizikisi ichashandiswa muzvigadzirwa kubva kuFA kuenda kuPPA neCA

3. Kazhinji kukundikana kuongorora midziyo uye mabasa;

4. Main kukundikana modes uye inherent kukundikana nzira yemagetsi zvikamu;

5. Kutadza kuongororwa kwezvinhu zvakakura zvemagetsi, zviitiko zvekare zvehurema hwezvinhu (chip defects, crystal defects, chip passivation layer defects, bonding defects, process defects, chip bonding defects, imported RF devices - thermal structure defects, special defects, inherent structure, kukanganisa kwemukati, kukanganisa kwezvinhu; triode, MOS, IC, SCR, dunhu module, nezvimwewo)

6. Kushandiswa kwekukundikana kwefizikisi tekinoroji mukugadzirwa kwechigadzirwa

6.1 Mhosva dzekutadza kunokonzerwa nedhizaini isina kunaka

6.2 Mhosva dzekutadza kunokonzerwa nekusakodzera kuchengetedzwa kwekutapurirana kwenguva refu

6.3 Mhosva dzekutadza kunokonzerwa nekushandiswa zvisina kunaka kwezvikamu

6.4 Mhosva dzekutadza kunokonzerwa nekusakwana kwekukanganisa kwemusangano chimiro uye zvinhu

6.5 Kutadza nyaya dzekuchinjika kwezvakatipoteredza uye mishoni dhizaini dhizaini

6.6 Mhosva dzekutadza kukonzereswa nekufananidza zvisina kufanira

6.7 Mhosva dzekutadza kunokonzerwa nekusaita kushivirira dhizaini

6.8 Inherent mechanism uye kushaya simba kwekudzivirira

6.9 Kutadza kukonzerwa nechikamu cheparameter kugovera

6.10 FAILURE kesi dzinokonzerwa nePCB dhizaini

6.11 Mhosva dzekutadza dzakakonzerwa nekukanganisa kwedhizaini dzinogona kugadzirwa