Rudzi rwemhando: FR4
Layer count: 4
Min trace width/space: 4 mil
Min gomba saizi: 0.10mm
Yakapedzwa bhodhi ukobvu: 1.60mm
Yakapedzwa mhangura ukobvu: 35um
Pedzisa: ENIG
Solder mask ruvara: bhuruu
Nguva yekufambisa: 15 mazuva
Kubva muzana remakore rechi20 kusvika pakutanga kwezana remakore rechi21, dhipatimendi redhipatimendi remagetsi emagetsi riri kufambisa nguva yekukurumidza yekuvandudza tekinoroji, tekinoroji yemagetsi yakagadziridzwa nekukurumidza.Seyakadhindwa redunhu bhodhi indasitiri, chete nekusimudzira kwayo kunoenderana, inogona kugara ichizadzisa zvinodiwa nevatengi.Nemadiki, akareruka uye akaonda vhoriyamu yezvigadzirwa zvemagetsi, iyo yakadhindwa yedunhu bhodhi yakagadzira inochinjika bhodhi, yakasimba inochinjika bhodhi, mapofu akavigwa gomba redunhu bhodhi uye zvichingodaro.
Kutaura nezvemakomba akapofumadzwa / akavigwa, isu tinotanga neyechinyakare multilayer.Iyo yakajairwa yakawanda-layer redunhu redhisheni dhizaini inoumbwa nemukati wedunhu uye wekunze dunhu, uye maitiro ekuchera uye metalization mugomba inoshandiswa kuita basa rekubatana kwemukati kwega rega redunhu.Nekudaro, nekuda kwekuwedzera kwemitsara density, iyo yekurongedza modhi yezvikamu inogara ichivandudzwa.Kuti iite kuti nzvimbo yebhodhi redunhu ive shoma uye inobvumira kuti iwedzere uye yakakwirira mashandiro ekuita, kuwedzera kune yakatetepa mutsara upamhi, iyo aperture yakaderedzwa kubva pa1 mm yeDIP jack aperture kusvika 0.6 mm yeSMD, uye yakawedzera kuderedzwa kusvika isingasviki. 0.4mm.Nekudaro, nzvimbo yekumusoro ichiri kugarwa, saka gomba rakavigwa uye gomba rebofu rinogona kugadzirwa.Tsanangudzo yegomba rakavigwa uye gomba rebofu rakaita seizvi:
Buired hole:
Iyo kuburikidza negomba pakati pemukati wemukati, mushure mekudzvanya, haigone kuonekwa, saka haidi kutora nzvimbo yekunze, mativi ekumusoro uye ezasi egomba ari muchikamu chemukati chebhodhi, nemamwe mazwi, akavigwa mukati. board
Blinded hole:
Inoshandiswa pakubatanidza pakati pepamusoro pepamusoro uye imwe kana yakawanda yemukati.Rimwe divi regomba riri kune rumwe rutivi rwebhodhi, uye ipapo gomba rinobatanidzwa mukati mebhodhi.
Kubatsira kwebhodhi rakapofumadzwa uye rakavigwa gomba:
Mune isiri-perforating gomba tekinoroji, kushandiswa kwegomba rebofu uye gomba rakavigwa kunogona kuderedza zvakanyanya saizi yePCB, kuderedza huwandu hwematanho, kunatsiridza kuenderana kwemagetsi, kuwedzera hunhu hwezvigadzirwa zvemagetsi, kuderedza mutengo, uye zvakare kugadzira dhizaini. shanda zviri nyore uye nekukurumidza.Muchinyakare PCB dhizaini uye kugadzirisa, kuburikidza-gomba kunogona kukonzera matambudziko mazhinji.Chekutanga, ivo vanotora yakakura nzvimbo inoshanda.Chechipiri, nhamba huru ye-maburi munzvimbo ine dense zvakare inokonzera zvipingamupinyi zvakakura kune wiring yemukati wemukati we-multi-layer PCB.Aya maburi-maburi anotora nzvimbo inodiwa kune wiring, uye anofamba zvakanyanya nepamusoro peiyo magetsi uye pasi waya layer, iyo inoparadza iyo impedance hunhu hwesimba rekupa pasi waya layer uye kukonzera kutadza kwemagetsi epasi waya. layer.Uye kuchera kwakajairika kwemuchina kuchave kwakapetwa makumi maviri sekushandiswa kweiyo isiri-perforating gomba tekinoroji.
Tarisa pakupa mong pu mhinduro kwemakore mashanu.