Rudzi rwemhando: ceramic base
Layer count: 1
Min trace width/space: 6 mil
Min gomba saizi: 1.6mm
Yakapedzwa bhodhi ukobvu: 1.00mm
Yakapedzwa mhangura ukobvu: 35um
Pedzisa: ENIG
Solder mask ruvara: bhuruu
Nguva yekufambisa: 13 mazuva
Ceramic substrate inoreva foil yemhangura patembiricha yakakwira yakanangana nealuminium oxide (Al2O3) kana aluminium nitride (AlN) ceramic substrate pamusoro (imwe kana kaviri) yakakosha process plate. Iyo yekupedzisira-yakaonda inoumbwa substrate ine yakanakisa magetsi ekudzivirira kuita, yakakwira yekupisa conductivity, yakanakisa yakapfava brazing chivakwa uye yakakwirira adhesion simba, uye inogona kumisa marudzi ese emifananidzo senge PCB board, ine yakakura ikozvino kutakura. Naizvozvo, ceramic substrate yave iyo yakakosha zvinhu zveakakwira simba remagetsi redunhu chimiro tekinoroji uye yekubatanidza tekinoroji.
Kubatsira kweceramic based board:
Yakasimba mechanical stress, yakagadzikana chimiro; Simba guru, high thermal conductivity, high insulation; Kunamatira kwakasimba, anti-corrosion.
◆ Kushanda kwakanaka kwekushisa kwekushisa, kutenderera nguva kusvika ku50,000 nguva, kuvimbika kwepamusoro.
◆ Chimiro chemifananidzo yakasiyana-siyana inogona kuiswa sePCB (kana IMS substrate); Hapana kusvibiswa, hapana kusvibiswa.
◆ Kupisa kwebasa ndiko -55℃ ~ 850℃; Iyo yekupisa yekuwedzera coefficient iri padyo nesilicon, iyo inorerutsa maitiro ekugadzira emagetsi module.
Kushandiswa kweceramic based board:
Ceramic substrates (alumina, aluminium nitride, silicon nitride, zirconia uye zirconia toughening alumina inonzi ZTA) nekuda kwekunaka kwayo kwekushisa, mechanical, makemikari, uye dielectric properties, inoshandiswa zvakanyanya mu semiconductor chip packaging, sensors, magetsi ekutaurirana, mbozhanhare uye. mamwe akangwara terminal, zviridzwa nemamita, simba idzva, mwenje mutsva sosi, auto high-speed njanji, simba remhepo, marobhoti, aerospace nemauto ekudzivirira uye mamwe minda yepamusoro-tech. Maererano nehuwandu, gore negore zvakasiyana-siyana zveceramic substrate kukosha zvakasvika makumi emabhiriyoni emusika, kunyanya mumakore achangopfuura, nekukurumidza kweChina mumotokari itsva dzesimba, njanji yepamusoro uye 5 g base zviteshi, ceramic substrate inoda yakakura, mumotokari chete. nharaunda, huwandu hunodiwa gore rega rega hunosvika 5 miriyoni PCS; Alumina ceramic substrate haingoshandiswi zvakanyanya muindasitiri yemagetsi neyemagetsi, asiwo mune yekumanikidza sensor uye LED kupisa disipation munda.
Inoshandiswa zvakanyanya munzvimbo dzinotevera dze5:
1.IGBT module yechitima chepamusoro-soro, motokari itsva dzemagetsi, kugadzirwa kwemagetsi emhepo, marobhoti uye 5G base stations;
2.Smart phone backplane uye kuzivikanwa kweminwe;
3.Chizvarwa chitsva chakasimba masero emafuta;
4.New flat plate pressure sensor uye oxygen sensor;
5.LD/LED kupisa kupisa, laser system, hybrid integrated circuit;
Tarisa pakupa mong pu mhinduro kwemakore mashanu.