Anokwikwidza PCB Mugadziri

single sided kunyudzwa goridhe Ceramic based Board

Tsanangudzo Pfupi

Rudzi rwemhando: ceramic base

Layer count: 1

Min trace width/space: 6 mil

Min gomba saizi: 1.6mm

Yakapedzwa bhodhi ukobvu: 1.00mm

Yakapedzwa mhangura ukobvu: 35um

Pedzisa: ENIG

Solder mask ruvara: bhuruu

Nguva yekufambisa: 13 mazuva


Product Detail

Product Tags

Rudzi rwemhando: ceramic base

Layer count: 1

Min trace width/space: 6 mil

Min gomba saizi: 1.6mm

Yakapedzwa bhodhi ukobvu: 1.00mm

Yakapedzwa mhangura ukobvu: 35um

Pedzisa: ENIG

Solder mask ruvara: bhuruu

Nguva yekufambisa: 13 mazuva

ceramic based board

Ceramic substrate inoreva foil yemhangura patembiricha yakakwira yakanangana nealuminium oxide (Al2O3) kana aluminium nitride (AlN) ceramic substrate pamusoro (imwe kana kaviri) yakakosha process plate.Iyo yekupedzisira-yakaonda inoumbwa substrate ine yakanakisa kuvharisa kwemagetsi kuita, yakakwira yekupisa conductivity, yakanakisa yakapfava brazing chivakwa uye yakakwirira adhesion simba, uye inogona kumisa marudzi ese emifananidzo senge PCB board, ine yakakura ikozvino kutakura.Naizvozvo, ceramic substrate yave chinhu chakakosha chesimba remagetsi redunhu redhisheni tekinoroji uye yekubatanidza tekinoroji.

Kubatsira kweceramic based board:

Kushushikana kwemagetsi kwakasimba, chimiro chakagadzikana;Simba guru, high thermal conductivity, high insulation;Kunamatira kwakasimba, anti-corrosion.

◆ Kushanda kwakanaka kwekushisa kwekushisa, kutenderera nguva kusvika ku50,000 nguva, kuvimbika kwepamusoro.

◆ Chimiro chemifananidzo yakasiyana-siyana inogona kuiswa sePCB (kana IMS substrate);Hapana kusvibiswa, hapana kusvibiswa.

◆ Tembiricha yebasa iri -55℃ ~ 850℃;Iyo yekupisa yekuwedzera coefficient iri padyo nesilicon, iyo inorerutsa maitiro ekugadzira emagetsi module.

Kushandiswa kweceramic based board:

Ceramic substrates (alumina, aluminium nitride, silicon nitride, zirconia uye zirconia toughening alumina inonzi ZTA) nekuda kwekunaka kwayo kwekushisa, mechanical, makemikari, uye dielectric properties, inoshandiswa zvakanyanya mu semiconductor chip packaging, sensors, magetsi ekutaurirana, nharembozha uye. mamwe akangwara terminal, zviridzwa nemamita, simba idzva, mwenje mutsva sosi, auto high-speed njanji, simba remhepo, marobhoti, aerospace nemauto ekudzivirira uye mamwe minda yepamusoro-soro.Maererano nehuwandu, gore negore zvakasiyana-siyana zveceramic substrate kukosha zvakasvika makumi emabhiriyoni emusika, kunyanya mumakore achangopfuura, neChina kukurumidza kukura mumotokari itsva dzesimba, njanji yepamusoro uye 5 g base zviteshi, ceramic substrate inoda yakakura, mumotokari chete. nharaunda, iyo inodiwa huwandu gore rega rega inosvika 5 miriyoni PCS;Alumina ceramic substrate haingoshandiswi zvakanyanya muindasitiri yemagetsi neyemagetsi, asiwo mune yekumanikidza sensor uye LED kupisa disipation munda.

Inoshandiswa zvakanyanya munzvimbo dzinotevera dze5:

1.IGBT module yechitima chepamusoro-soro, motokari itsva dzemagetsi, kugadzirwa kwemagetsi emhepo, marobhoti uye 5G base stations;

2.Smart phone backplane uye kuzivikanwa kweminwe;

3.Chizvarwa chitsva chakasimba masero emafuta;

4.New flat plate pressure sensor uye oxygen sensor;

5.LD/LED kupisa kupisa, laser system, hybrid integrated circuit;


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